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The influence of surface topography on the field emission of nanostructured copper oxide thin films grown by oblique incidence deposition

机译:表面形貌对斜入射沉积生长的纳米结构氧化铜薄膜场发射的影响

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摘要

We report the surface morphology dependent enhanced field electron emission properties of copper oxide thin films, which are sputter deposited at two different incidence angles. The turn-on field is as low as 1.3 V mu m(-1) for obliquely deposited thin film, with an enhancement factor of similar to 5144. The emission current also shows good stability. With the help of finite element method analysis, we show that the enhanced field emission behaviour is due to the special surface topography of obliquely deposited film. While for the normally deposited film the screening effect plays an important role and thereby condemning the electron emission performance. We expect to have a general applicability of this study in the design of thin film based electron emitters.
机译:我们报告了以两种不同入射角溅射沉积的氧化铜薄膜的表面形貌依赖性增强场电子发射特性。倾斜沉积的薄膜的导通场低至1.3 Vμm(-1),增强因子类似于5144。发射电流也显示出良好的稳定性。借助有限元方法分析,我们表明增强的场发射行为是由于倾斜沉积膜的特殊表面形貌所致。尽管对于通常沉积的膜,屏蔽作用起着重要作用,从而谴责电子发射性能。我们希望这项研究在基于薄膜的电子发射器设计中具有普遍的适用性。

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