The Influence of Surface-Activated Bonding Treatment on the Peel Strength of Cu-Ni Metal Clad

摘要

Three different conditions of surface activation bonding, 0.5 m/min, 1.0 m/min and 1.5 m/min surface activation treatment speed, on copper and nickel substrate were investigated from the view point of adhesion of Cu-Ni clad metal. The specimen treated with surface activation treatment speed 1.0 m/min (Sample B) had higher peel strength properties than 0.5 m/min (Sample A) which has more long plasma treatment time. Observing the interface of clad with TEM and XPS spectra, sample B has relatively thin oxide interface including Cu_2O and sample A has thick oxide interface including CuO. From these result, it is suggested that the better adhesion of Cu-Ni clad on the SAB process is not due to the increase of plasma treatment exposure time but due more to the control of forming condition as much as thin Cu_2O layer growing epitaxial form.