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The Effects of Heat Treatment on the Bonding Strength of Surface-Activated Bonding (SAB)-Treated Copper-Nickel Fine Clad Metals

机译：热处理对表面活化键合（saB）处理铜镍细包覆金属结合强度的影响

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Kyung Hoon Kim; Sung Chul Lim; Hyouk Chon Kwon;
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1. The Influence of Surface-Activated Bonding Treatment on the Peel Strength of Cu-Ni Metal Clad [J] . Kyung Hoon Kim, Sung Chul Lim, Hyouk Chon Kwon Journal of nanoscience and nanotechnology . 2013,第5期

机译：表面活化结合处理对Cu-Ni金属熔覆层剥离强度的影响
2. Bonding Quality of Copper-Nickel Fine Clad Metal Prepared by Surface Activated Bonding [J] . Kyung Hoon Kim, Soon Hyung Hong, Seung Il Cha Materials transactions . 2010,第4期

机译：表面活化结合法制备的铜镍细包层金属的结合质量
3. Effect of Pre-Rolling Heat Treatments on the Bond Strength of Cladded Galvanized Steels in a Cold Roll Bonding Process [J] . Hordych Illia, Rodman Dmytro, Nuernberger Florian, Steel Research International . 2016,第12期

机译：轧前热处理对冷轧结合过程中覆层镀锌钢结合强度的影响
4. The Effects of Heat Treatment on the Bonding Strength of Surface-Activated Bonding (SAB)-Treated Copper-Nickel Fine Clad Metals [C] . Kyung Hoon Kim, Sung Chul Lim, Hyouk chon Kwon PRICM 7;Pacific Rim International Conference on Advanced Materials and Processing . 2011

机译：热处理对表面活性键合（SAB）处理的铜镍细包层金属的结合强度的影响
5. Ligand effects on the heats of protonation of metal-metal bonds in organometallic complexes [D] . Nataro, Chip 1997

机译：配体对有机金属配合物中金属-金属键的质子化热的影响
6. Effect of laser heat treatment on Pull-out bond strengthof fiber posts treated with different silanes [O] . Fereshteh Shafiei, Maryam Saadat, Zahra Jowkar 2018

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7. Bonding Quality of Copper-Nickel Fine Clad Metal Prepared by Surface Activated Bonding [O] . Kyung Hoon Kim, Soon Hyung Hong, Seung Il Cha, 2009

机译：表面活化粘接制备铜镍细包覆金属的粘接质量
8. Homolytic bond dissociation energies for C-H bonds adjacent to sulfur and aromatic moieties: The effects of substituents of C-H bond strengths of the benzylic positions in coal model compounds [R] . Alnajjar, M. S., Franz, J. A., Gleicher, G. J., 1993

机译：与硫和芳香族部分相邻的C-H键的均聚键解离能：煤模型化合物中苄基位置的C-H键强度取代基的影响

The Effects of Heat Treatment on the Bonding Strength of Surface-Activated Bonding (SAB)-Treated Copper-Nickel Fine Clad Metals

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