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首页> 外文期刊>Journal of Materials Science Letters >High-resolution electron microscopic studies of the interfaces between IBAD molybdenum and Al_2O_3(0001) substrate
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High-resolution electron microscopic studies of the interfaces between IBAD molybdenum and Al_2O_3(0001) substrate

机译:IBAD钼与Al_2O_3(0001)衬底之间界面的高分辨率电子显微镜研究

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摘要

Metal-ceramic interfaces play an important role in composites, electronic packaging systems, thin-film technology and joining metal-ceramic. With the development of high-resolution electronic micro-scopy (HREM) and cross-sectional specimen-pre-paration techniques, systematic studies of metal--ceramic interfaces, at the atomic scale, started in the 1980s [1]. Since then most of the experimental studies and theoretical calculations were originally performed on the examples serving as "model" systems (e.g. Nb/Al2O3 [2], Ag/MgO [3] interfaces), formed either by diffusion-bonding, internal oxida-tion or epitaxial film growth, where the lattice mismatch is small and both components possess the same lattice symmetry. Molybdenum films in inte-grated forms have various applications where high-temperature performance and high electronic conductivity are required. Al2O3(Q001) has been used as a substrate for molybdenum films because of its low dielectric loss, high mechanical strength and good insulating properties. However, little work has been done on the Mo/A^O.i interface in spite of its importance.
机译:金属陶瓷界面在复合材料,电子封装系统,薄膜技术和金属陶瓷接合中起着重要作用。随着高分辨率电子显微镜(HREM)和横截面样品制备技术的发展,金属-陶瓷界面的原子级系统研究始于1980年代[1]。从那时起,大多数实验研究和理论计算最初都是在作为“模型”系统(例如Nb / Al2O3 [2],Ag / MgO [3]界面)的示例上进行的,这些系统通过扩散键合,内部氧化晶格失配很小,并且两个组件都具有相同的晶格对称性。集成形式的钼膜在要求高温性能和高电子传导性的各种应用中具有重要的意义。 Al2O3(Q001)由于其低介电损耗,高机械强度和良好的绝缘性能而被用作钼薄膜的基材。但是,尽管Mo / A ^ O.i接口很重要,但几乎没有做任何工作。

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