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EFFECTS OF COMPOSITION AND SUBSTRATE TEMPERATURE ON THE AC PROPERTIES OF CO-EVAPORATED MN/SIOX THIN FILMS

机译:组成和基体温度对共蒸发的MN / SIOX薄膜的AC性能的影响

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摘要

Capacitance, a.c, conductance and loss factor have been measured in Cu-Mn/SiOx-Cu sandwich structures with compositions 1, 3, 5 and 10 at% Mn in the frequency range 10-10(6) Hz between temperatures of 110 and 500 K. The capacitance has a weak minim um at 1.0 MHz for all temperatures, whilst the a.c. conductance increases between four and eight orders of magnitude for temperatures of 150 and 473 K, respectively. Various a.c. conduction models have been considered, and it has been concluded that correlated barrier hopping best describes the results. The Goswami-Goswami model was used to describe the variation of loss factor with temperature and composition. [References: 16]
机译:已在Cu-Mn / SiOx-Cu夹层结构中测量了电容,交流电导率和损耗因子,其中成分Mn为1,3、5和10 at%的锰在110至500的温度范围内的频率范围为10-10(6)Hz K.在所有温度下,电容在1.0 MHz时的最小值都很弱,而交流电对于150和473 K的温度,电导分别增加4到8个数量级。各种交流已经考虑了传导模型,并得出结论,相关的势垒跳跃最能描述结果。 Goswami-Goswami模型用于描述损耗因子随温度和成分的变化。 [参考:16]

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