TiN thin films were deposited by DC reactive magnetron sputtering on AISI 304 and （100） Si wafer substrates, respectively. The effect of substrate temperature on microstructure and mechanical properties was studied using field emission scanning electron microscopy, X-ray diffraction and nanoindentation. The results show that the structure of TiN film is columnar,and the surface of the film is flat and dense. And the TiN film is facial central cubic （fcc） structure, and exhibits preferential orientation which is dependent on the substrate temperature applied. The preferential orientation of the thin film is （111） plane when the substrate temperature is between room temperature and 150 ~C, whereas it changes into （200） plane when the substrate temperature is between 300 ＊C and 450 ＊C. The thickness of TiN films increases when the substrate temperature increases from room temperature to 150 ~C, however, it almost doesn＇t obviously change when the substrate temperature continues to be increased. The grain size slightly increases with increasing the substrate temperature. Nanoindentation hardness, Young＇s modulus and toughness of the films increase as the substrate temperature increases, and their maximum values are 25.4, 289.4 and 0. 174 4 GPa, respectively.%采用直流反应磁控溅射方法在304不锈钢表面沉积TiN薄膜.利用场发射扫描电镜、X射线衍射仪和纳米压痕仪研究基体温度对TiN薄膜结构与性能的影响.结果表明：TiN薄膜为柱状结构,表面平整、致密.薄膜为面心立方结构（fcc）TiN并存在择优取向,室温和150℃时薄膜为（111）晶面择优取向,300和450℃时薄膜为（200）晶面择优取向;室温时薄膜厚度仅为0.63μm,加温到150℃后膜厚增加到1μm左右,但继续加温对膜厚影响不明显;平均晶粒尺寸随着基体温度的升高略有上升;薄膜的硬度、弹性模量和韧性（H3/E＊2）随基体温度的升高而增加,最值分别达到25.4,289.4和0.1744GPa.
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