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首页> 外文期刊>Journal of manufacturing science and engineering: Transactions of the ASME >Ablation Dynamics of Silicon by Femtosecond Laser and the Role of Early Plasma
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Ablation Dynamics of Silicon by Femtosecond Laser and the Role of Early Plasma

机译:飞秒激光对硅的烧蚀动力学及其在等离子体中的作用

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摘要

In this paper, the femtosecond laser ablation of silicon is investigated by a two-dimensional hydrodynamic model. The ablation depth of the silicon wafer ablated in air at different laser intensities is calculated, and the corresponding experimental measurements are carried out for validation. Two different ablation regimes have been identified by varying the laser fluence. While two-photon absolution dominates in the low fluence regime (<2J/cm~2), electron heat diffusion is a major energy transport mechanism at higher laser fluences (>2J/cm~2). The ablation efficiency first increases with the laser fluence, and reaches the peak value at the laser fluence around 8J/cm~2. It starts to drop when the laser fluence further increases, because of the early plasma absorption of the laser beam energy.
机译:本文通过二维流体动力学模型研究了飞秒激光烧蚀硅。计算了在不同激光强度下在空气中烧蚀的硅片的烧蚀深度,并进行了相应的实验测量以进行验证。通过改变激光能量密度已经确定了两种不同的消融方案。在低能量密度(<2J / cm〜2)中,两光子的绝对吸收占主导,而在较高的激光能量密度(> 2J / cm〜2)下,电子热扩散是主要的能量传输机制。烧蚀效率首先随着激光能量密度的增加而增加,并在激光能量密度达到约8J / cm〜2时达到峰值。当激光通量进一步增加时,由于激光束能量的早期等离子体吸收,其开始下降。

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