Direct analysis laser machine for microelectronics industry, has ablation unit with femtosecond laser source, and laser beam displacement unit allowing displacement of laser beam on sample`s surface in two directions parallel to surface

摘要

The machine has an ablation enclosure (1) with a sample holder (5) holding a sample (6) with a surface (7) to be analyzed. A laser ablation unit (9) with a femtosecond laser source reflects a laser beam (10) on the surface to strip an ablation zone for producing ablated units to be analyzed. Atomization and ionization source (14) transforms the ablated units into atoms and ions. A laser beam displacement unit (18) reflects the beam on the zone and allows displacement of the beam on the surface in two directions parallel to the surface.