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Electrical and thermoelectric properties of SbI3-doped 33.3%Bi2Te3-66.7%Sb2Te3 thermoelectric semiconductors

机译:掺杂SbI3的33.3%Bi2Te3-66.7%Sb2Te3热电半导体的电和热电性能

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摘要

The temperature dependences of the electrical andthermoelectric properties of the SbI3-doped 33.3% Bi2Te3-66.7%Sb2Te3 single crystals have been measured at temperatures rangingfrom 77K to 600K. The scattering parameter of the 33.3%Bi2Te3-66.7% Sb2Te3 single crystals was determined as s=0.With increasing the amount of SbI3 dopant, the hole concentrationof the 33.3% Bi2Te3-66.7% Sb2Te3 single crystal is decreased,resulting in the increment of the Seebeck coefficient and electricalresistivity, and the temperature for the maximum figure-of-meritshifted to lower temperature. A maximum figure-of-merit of2.3×10-3/K was obtained for 0.3 wt% Sbi3-doped specimen. Ithas been revealed that the addition of SbI3 as a donor dopant isuseful in controlling the hole concentration of p-type 33.3%Bi2Te3-66.7% Sb2Te3 alloy system.
机译:已经在77K至600K的温度范围内测量了SbI3掺杂的33.3%Bi2Te3-66.7%Sb2Te3单晶的电和热电性质的温度依赖性。确定了33.3%Bi2Te3-66.7%Sb2Te3单晶的散射参数为s = 0。随着SbI3掺杂量的增加,33.3%Bi2Te3-66.7%Sb2Te3单晶的空穴浓度降低,结果是塞贝克系数和电阻率以及最大品质因数的温度都移到了较低的温度。对于0.3重量%的Sbi3掺杂的样品,获得的最大品质因数为2.3×10-3 / K。已经发现,添加SbI 3作为施主掺杂剂可用于控制p型33.3%Bi 2 Te 3 -66.7%Sb 2 Te 3合金体系的空穴浓度。

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