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Application of Plasma Cleaning for Plating Pretreatment

机译:等离子清洗在电镀前处理中的应用

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Pretreatment process is very important in plating process because failure of deposits almost comes from inadequate pretreatment. Recently, in leadframe manufacturing, plasma is used for metal cleaning and modification of polymeric materials. In this study we investigated a possibility of plasma pretreatment for coating technology. Plasma pretreatment was performed for pretreatment in vacuum chamber using Ar and H_2 gas. Specimens were prepared with copper plate. Then, specimens were plated in Ni sulfamate bath using DC and pulse current. To prevent reoxidation of speciemens, plating was conducted immediatly alter pretreatment. The surface morphology and roughness were examined by AFM, SEM. And surface residual oxide was investigated with XRD. Also adhesion test was performed by acoustic emission. In the test results optimum gas ratio was 1(Ar) : 4(H_2).
机译:预处理过程在电镀过程中非常重要,因为沉积物的失效几乎是由于预处理不足所致。最近,在引线框架制造中,等离子体用于金属清洁和聚合物材料的改性。在这项研究中,我们研究了涂层技术进行等离子体预处理的可能性。进行等离子体预处理以在真空室中使用Ar和H_2气体进行预处理。用铜板制备样品。然后,使用直流电和脉冲电流将样品镀在氨基磺酸镍浴中。为防止试样再氧化,应在预处理前立即进行电镀。通过AFM,SEM检查表面形态和粗糙度。并用XRD研究了表面残留氧化物。还通过声发射进行粘附力测试。在测试结果中,最佳气体比为1(Ar):4(H_2)。

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