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首页> 外文期刊>Journal of Electron Microscopy >Heat- and electron-beam-induced transport of gold particles into silicon oxide and silicon studied by in situ high-resolution transmission electron microscopy.
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Heat- and electron-beam-induced transport of gold particles into silicon oxide and silicon studied by in situ high-resolution transmission electron microscopy.

机译:通过原位高分辨率透射电子显微镜研究了热和电子束诱导的金颗粒向氧化硅和硅中的传输。

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摘要

In this study, we describe the transport of gold (Au) nanoparticles from the surface into crystalline silicon (Si) covered by silicon oxide (SiO(2)) as revealed by in situ high-resolution transmission electron microscopy. Complete crystalline Au nanoparticles sink through the SiO(2) layer into the Si substrate when high-dose electron irradiation is applied and temperature is raised above 150 degrees C. Above temperatures of 250 degrees C, the Au nanoparticles finally dissolve into fragments accompanied by crystallization of the amorphized Si substrate around these fragments. The transport process is explained by a wetting process followed by Stokes motion. Modelling this process yields boundaries for the interface energies involved.
机译:在这项研究中,我们描述了金(Au)纳米粒子从表面到由氧化硅(SiO(2))覆盖的结晶硅(Si)的运输,如原位高分辨率透射电子显微镜所揭示。当施加高剂量电子辐照并且温度升高到150摄氏度以上时,完整的晶体金纳米颗粒会通过SiO(2)层沉入硅基板中。温度超过250摄氏度时,金纳米颗粒最终会溶解成碎片,并伴随结晶这些碎片周围的非晶硅衬底的厚度。传输过程由润湿过程和斯托克斯运动解释。对这个过程进行建模会产生所涉及的界面能的边界。

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