...
首页> 外文期刊>Journal of Electronic Materials >Consideration of parameter scattering in thermo mechanical characterization of advanced packages
【24h】

Consideration of parameter scattering in thermo mechanical characterization of advanced packages

机译:在高级封装的热机械表征中考虑参数散射

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

Much progress has been made in the simulation and verification of the thermo-mechanical behavior of plastic packages. On the other hand, until now there is a lack in the consideration of the scatter or uncertainty, respectively, of certaincharacteristics. A comparatively large scatter of local material properties or random geometrical imperfections can often be observed within the material compounds of electronic packages. The partial randomness of certain input parameters createsuncertainties in the finite element determination of mechanical quantities which are provided for thermo-mechanical reliability optimization and life time prediction. In the following the STOFEM stochastic finite element approach based on perturbationtheory is applied as a part of the finite element simulation. It is used to find out some additional effects arising from uncertainties in the modeling, slightly varying parameters or probabilistic influences, respectively. In a second part of the paper;another approach to the consideration of random variations is discussed. It is based on the randomization of initially deterministic relations.
机译:在模拟和验证塑料包装的热机械性能方面已经取得了很大进展。另一方面,到目前为止,仍缺乏对某些特性的分散性或不确定性的考虑。在电子封装的材料化合物中通常会观察到较大的局部材料特性或随机几何缺陷的散布。某些输入参数的部分随机性在确定机械量的有限元中产生了不确定性,这些不确定性为热机械可靠性优化和寿命预测提供了不确定性。接下来,将基于摄动理论的STOFEM随机有限元方法用作有限元模拟的一部分。它用于找出建模不确定性,参数略有变化或概率影响分别引起的一些其他影响。在本文的第二部分中,讨论了考虑随机变化的另一种方法。它基于初始确定性关系的随机化。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号