首页> 外文OA文献 >Thermo-mechanical and Mold Flow Analyses of Die Shift in Wafer Reconstitution Process for Advanced Packaging Technology

【2h】

Thermo-mechanical and Mold Flow Analyses of Die Shift in Wafer Reconstitution Process for Advanced Packaging Technology

机译：高级包装技术晶圆重构过程中的热机械和模具流程分析

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Cheng-Ying Yang; Yu-Cheng Liu; Kuo-Shen Chen; Tian-Shiang Yang; Yao-Chen Wang;
展开▼
作者单位

展开▼
年度 2017
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Die Shift Assessment of Reconstituted Wafer for Fan-Out Wafer-Level Packaging [J] . Cheng Hsien-Chie, Chung Chia-Heng, Chen Wen-Hwa IEEE transactions on device and materials reliability . 2020,第1期

机译：用于扇出晶圆级包装的重构晶圆的模切评估
2. Viscoelastic Warpage Modeling of Fan-Out Wafer-Level Packaging During Wafer-Level Mold Cure Process [J] . Cheng Hsien-Chie, Wu Zong-Da, Liu Yan-Cheng Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2020,第7期

机译：玻璃水平模具固化过程中扇出晶圆级包装的粘弹性翘曲建模
3. Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing [J] . Fukushima T., Iwata E., Ohara Y., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2011,第12期

机译：多芯片自组装技术，用于先进的晶片对晶片3D集成，以精确地将批处理中的已知良好管芯对准
4. Thermo-Mechanical Process Emulation and Sensitivity Analysis of Wafer Warpage after Reconstitution in Fan-out Packaging [C] . Cheng-Ying Yang, Kuo-Shen Chen, Tian-Shian g Yang, International Conference on Electronics Packaging . 2019

机译：扇出式包装重构后晶圆翘曲的热机械过程仿真和灵敏度分析
5. A Novel Three Dimensional Wafer Level Chip Scale Packaging Technology-Manufacturing Process Development and Reliability Characterizations. [D] . Li, Zhaozhi. 2010

机译：一种新颖的三维晶圆级芯片级封装技术-制造工艺开发和可靠性表征。
6. Compensation Method for Die Shift Caused by Flow Drag Force in Wafer-Level Molding Process [O] . Simo Yeon, Jeanho Park, Hye-Jin Lee 2016

机译：晶圆级成型过程中流动阻力引起的模头位移补偿方法
7. Foreword: Special Section on Advanced Packaging, Materials, Processing, and Reliability: Cutting-Edge Solutions for High-Density Wafer-/Panel-Level and Thin, Flexible, Mobile Packages [O] . Karlheinz Bock 2020

机译：前言：高级包装，材料，加工和可靠性的专题部分：高密度晶片/面板级和薄，灵活，移动套件的尖端解决方案
8. Development of a Center for Advanced Mold/Mask Processes and Applications for the Miniaturization Technologies. [R] . Varahramyan, K., Coane, P., Hosseini, M., 2002

机译：开发先进模具/掩模工艺中心和小型化技术应用。

Thermo-mechanical and Mold Flow Analyses of Die Shift in Wafer Reconstitution Process for Advanced Packaging Technology

著录项

引文网络

相似文献

相关主题

期刊订阅