Innovative Wire Bonding Method Using a Chemically Reacted Thin Layer for Chips with Copper Interconnects

摘要

This paper presents a novel method in which an oxide film is used to facilitate the thermosonic wire bonding of gold wire onto copper pads.A cuprous oxide film is generated by controlling the pH values of the chemical solution.Compared to cupric oxide films,the cuprous oxide film is denser and more brittle and therefore facilitates the bonding process without the need for the elaborate procedures and equipment required by more conventional wire bonding methods.