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首页> 外文期刊>Journal of Electronic Materials >High-Performance LWIR MBE-Grown HgCdTe/Si Focal Plane Arrays
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High-Performance LWIR MBE-Grown HgCdTe/Si Focal Plane Arrays

机译:高性能LWIR MBE生长的HgCdTe / Si焦平面阵列

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We have been actively pursuing the development of long-wavelength infrared(LWIR)HgCdTe grown by molecular beam epitaxy(MBE)on large-area silicon substrates.The current effort is focused on extending HgCdTe/Si technology to longer wavelengths and lower temperatures.The use of Si versus bulk CdZnTe substrates is being pursued due to the inherent advantages of Si,which include available wafer sizes(as large as 300 mm),lower cost(both for the substrates and number of die per wafer),compatibility with semiconductor processing equipment,and the match of the coefficient of thermal expansion with silicon read-out integrated circuit(ROIC).Raytheon has already demonstrated low-defect,high-quality MBE-grown HgCdTe/Si as large as 150 mm in diameter.The focal plane arrays(FPAs)presented in this paper were grown on 100 mm diameter(211)Si substrates in a Riber Epineat system.The basic device structure is an MBE-grown p-on-n heterojunction device.Growth begins with a CdTe/ZnTe buffer layer followed by the HgCdTe active device layers;the entire growth process is performed in situ to maintain clean interfaces between the various layers.In this experiment the cutoff wavelengths were varied from 10.0 mu m to 10.7 mu m at 78 K.Detectors with >50% quantum efficiency and R_0A ~1000 Ohms cm~2 were obtained,with 256 x 256,30 mu m focal plane arrays from these detectors demonstrating response oper-abilities >99%.
机译:我们一直在积极寻求通过分子束外延(MBE)在大面积硅衬底上生长的长波长红外(LWIR)HgCdTe的研究,目前的工作重点是将HgCdTe / Si技术扩展到更长的波长和更低的温度。由于Si的固有优势,因此一直在寻求使用Si与块状CdZnTe衬底的比较优势,包括可用的晶片尺寸(大至300 mm),较低的成本(包括衬底和每个晶片的管芯数量),与半导体工艺的兼容性。雷神公司已经展示了直径低至150 mm的低缺陷,高质量的MBE生长的HgCdTe / Si。焦平面本文提出的阵列(FPA)在Riber Epineat系统中的100 mm直径(211)Si衬底上生长。基本器件结构是MBE生长的p-on-n异质结器件。生长始于CdTe / ZnTe缓冲液层后跟HgCdTe有源器件层;整个生长过程均在原位进行,以保持各层之间的清洁界面。在该实验中,截止波长在78 K下从10.0微米变化到10.7微米,检测器的量子效率> 50%这些探测器获得了R_0A〜1000 Ohm cm〜2,并具有256 x 256,30μm焦平面阵列,表明响应可操作性> 99%。

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