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首页> 外文期刊>Journal of Electronic Materials >High-Performance M/LWIR Dual-Band HgCdTe/Si Focal-Plane Arrays
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High-Performance M/LWIR Dual-Band HgCdTe/Si Focal-Plane Arrays

机译:高性能M / LWIR双波段HgCdTe / Si焦平面阵列

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摘要

Mercury cadmium telluride (HgCdTe) grown on large-area silicon (Si) substrates allows for larger array formats and potentially reduced focal-plane array (FPA) cost compared with smaller, more expensive cadmium zinc telluride (CdZnTe) substrates. In this work, the use of HgCdTe/Si for mid-wavelength/long-wavelength infrared (M/LWIR) dual-band FPAs is evaluated for tactical applications. A number of M/LWIR dual-band HgCdTe triple-layer n-P-n heterojunction device structures were grown by molecular-beam epitaxy (MBE) on 100-mm (211)Si substrates. Wafers exhibited low macrodefect densities (< 300 cm~(-2)). Die from these wafers were mated to dual-band readout integrated circuits to produce FPAs. The measured 81-K cutoff wavelengths were 5.1 μm for band 1 (MWIR) and 9.6 μm for band 2 (LWIR). The FPAs exhibited high pixel operability in each band with noise-equivalent differential temperature operability of 99.98% for the MWIR band and 98.7% for the LWIR band at 81 K. The results from this series are compared with M/LWIR FPAs from 2009 to address possible methods for improvement. Results obtained in this work suggest that MBE growth defects and dislocations present in devices are not the limiting factor for detector operability, with regards to infrared detection for tactical applications.
机译:与更小,更昂贵的碲化镉锌(CdZnTe)衬底相比,在大面积硅(Si)衬底上生长的碲化汞(HgCdTe)允许更大的阵列格式并可能降低焦平面阵列(FPA)的成本。在这项工作中,针对战术应用评估了HgCdTe / Si在中波长/长波长红外(M / LWIR)双波段FPA中的使用。通过分子束外延(MBE)在100 mm(211)Si衬底上生长了许多M / LWIR双带HgCdTe三层n-P-n异质结器件结构。晶圆表现出低的宏观缺陷密度(<300 cm〜(-2))。将这些晶片的芯片与双频读出集成电路配对,以生产FPA。测得的81-K截止波长对于频段1(MWIR)为5.1μm,对于频段2(LWIR)为9.6μm。这些FPA在每个频段上均表现出高像素可操作性,在81 K时,MWIR频段的等效噪声温度差异可操作性为99.98%,LWIR频段的等效噪声温度差异为98.7%。将该系列的结果与2009年的M / LWIR FPA进行比较可能的改进方法。在这项工作中获得的结果表明,就战术应用的红外检测而言,设备中存在的MBE生长缺陷和位错不是检测器可操作性的限制因素。

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