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Development of High-Performance eSWIR HgCdTe-Based Focal-Plane Arrays on Silicon Substrates

机译:硅基底上高性能基于eSWIR HgCdTe的焦平面阵列的开发

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摘要

We report the development of high-performance and low-cost extended short-wavelength infrared (eSWIR) focal-plane arrays (FPAs) fabricated from molecular beam epitaxial (MBE)-grown HgCdTe on Si-based substrates. High-quality n-type eSWIR HgCdTe (cutoff wavelength similar to 2.68 mu m at 77 K, electron carrier concentration 5.82 x 10(15) cm(-3)) layers were grown on CdTe/Si substrates by MBE. High degrees of uniformity in composition and thickness were demonstrated over three-inch areas, and low surface defect densities (voids 9.56 x 10(1) cm(-2), micro-defects 1.67 x 10(3) cm(-2)) were measured. This material was used to fabricate 320 x 256 format, 30 mu m pitch FPAs with a planar device architecture using arsenic implantation to achieve p-type doping. The dark current density of test devices showed good uniformity between 190 K and room temperature, and high-quality eSWIR imaging from hybridized FPAs was obtained with a median dark current density of 2.63 x 10(-7) A/cm(2) at 193 K with a standard deviation of 1.67 x 10(-7) A/cm(2).
机译:我们报告了高性能和低成本的扩展的短波红外(eSWIR)焦平面阵列(FPA)的发展,该阵列是由硅基衬底上的分子束外延(MBE)生长的HgCdTe制成的。 MBE在CdTe / Si衬底上生长了高质量的n型eSWIR HgCdTe(在77 K处的截止波长类似于2.68μm,电子载流子浓度为5.82 x 10(15)cm(-3))。在三英寸的区域内证明了成分和厚度的高度均匀性,并且表面缺陷密度低(空隙9.56 x 10(1)cm(-2),微缺陷1.67 x 10(3)cm(-2))被测量。该材料用于制造平面器件架构的320 x 256格式,30微米间距FPA,并使用砷注入来实现p型掺杂。测试设备的暗电流密度在190 K和室温之间显示出良好的均匀性,并且在193°C下,杂化FPA获得的高质量eSWIR成像的中值暗电流密度为2.63 x 10(-7)A / cm(2) K,标准偏差为1.67 x 10(-7)A / cm(2)。

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