Effect of Process Conditions on Uniformity of Velocity and Wear Distance of Pad and Water during Chemcial mechanical Planarization

摘要

the kinematics of conventional,rotary chemical mechanical planarization (CMP) was analyzed,and its effect on polishing results wasassessed.The authors define a novel parameter,zeta,as a "kinematic number",which includes the effects of wafter size,distance between rotation centers,and rotation ratio between wafer and pad.The analysis result suggests that velocity distribution,direction of friction force,uniformity of velocity distribution,distribution of sliding distance,and uniformity of sliding-distance distribution could be consistently expressed in terms of the kinematic number zeta.These results become more important as the wafer size increases and the requirement of within-wafer nonuniformity is more stringent.