Investigation of Interfacial Reaction Between Sn-Ag Eutectic Solder and Au/Ni/Cu/Ti Thin Film Metallization

J.Y. Park; C.W. Yang; J.S. Ha

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Investigation of Interfacial Reaction Between Sn-Ag Eutectic Solder and Au/Ni/Cu/Ti Thin Film Metallization

机译：Sn-Ag共晶焊料与Au / Ni / Cu / Ti薄膜金属化界面反应的研究

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摘要

This paper reports the formation of intermetallic compounds in Au/Ni/Cu/Ti under-bump-metallization (UBM) structure reacted with Ag-Sn eutectic solder.

机译：本文报道了与Ag-Sn共晶焊料反应的Au / Ni / Cu / Ti凸点欠金属化（UBM）结构中金属间化合物的形成。

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来源
《Journal of Electronic Materials》 |2001年第9期|共6页
作者
J.Y. Park; C.W. Yang; J.S. Ha;
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原文格式 PDF
正文语种 eng
中图分类材料;
关键词
flip chip; UBM; Ni thin layer; diffusion; intermetallics;

机译：倒装芯片;UBM;镍薄层;扩散;金属间化合物;

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专利

1. Investigation of Interfacial Reaction Between Sn-Ag Eutectic Solder and Au/Ni/Cu/Ti Thin Film Metallization [J] . J.Y. Park, C.W. Yang, J.S. Ha Journal of Electronic Materials . 2001,第9期

机译：Sn-Ag共晶焊料与Au / Ni / Cu / Ti薄膜金属化界面反应的研究
2. The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy [J] . Sun-Kyoung Seo, Sung K. Kang, Moon Gi Cho, Journal of Electronic Materials . 2009,第12期

机译：凸块冶金中与Cu和Ni（P）的界面反应影响Sn-Ag和Sn-Cu焊料中β-Sn晶粒的晶体取向
3. Investigation of interfacial reaction between eutectic Sn-Pb solder droplet and Au/Ni/Cu pad [J] . F. Q. Li, C. Q. Wang Materials Science and Technology: MST: A publication of the Institute of Metals . 2008,第6期

机译：共晶Sn-Pb焊滴与Au / Ni / Cu垫之间的界面反应研究
4. Effect of au on interfacial reactions of eutectic SnPb and SnAgCu solders with Al/Ni(V)/Cu thin film metallization [C] . Fan Zhang, Chan Choy Chum, Ming Li Electronic Components and Technology Conference, 2002. Proceedings. 52nd . 2002

机译：au对Al / Ni（V）/ Cu薄膜金属化共晶SnPb和SnAgCu焊料界面反应的影响
5. Wetting behaviors and interfacial reactions of lead-containing and lead-free solder alloys on gold, palladium, nickel foils, leadframes, and under-bump thin film metallizations in electronic packaging. [D] . Kim, Patrick Gu-Ho. 1998

机译：含铅和无铅焊料合金在电子包装中的金，钯，镍箔，引线框架和凸块下的薄膜金属上的润湿行为和界面反应。
6. Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders [O] . Tomi Laurila, Vesa Vuorinen 2009

机译：镍金属化与各种无铅焊料之间界面反应的热力学动力学综合分析
7. Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization [O] . Akio Hirose, Tomoyuki Hiramori, Mototaka Ito, 2016

机译：sn-ag和sn-ag-Cu无铅焊料的界面微观结构和接合强度回流Cu / Ni-p / au金属化
8. Interfacial reaction in a-Si/Au and a-Si/Cu thin film bilayers [R] . Heald, S M, Tan, Z 1992

机译：a-si / au和a-si / Cu薄膜双层中的界面反应

Investigation of Interfacial Reaction Between Sn-Ag Eutectic Solder and Au/Ni/Cu/Ti Thin Film Metallization

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