Electroless Ni/Immersion Au Interconnects: Investigation of Black Pad in Wire Bonds and Solder Joints

P. Snugovsky; P. Arrowsmith; M. Romansky

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Electroless Ni/Immersion Au Interconnects: Investigation of Black Pad in Wire Bonds and Solder Joints

机译：化学镀镍/浸金互连：焊线和焊点中的黑色焊盘的研究

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摘要

Black Pad was observed on Electroless Ni/Immersion Au (ENIG) wire bond pads. Thick immersion Au on highly corroded electroless Ni was detected.

机译：在化学镍/浸金（ENIG）引线键合焊盘上观察到黑色焊盘。检测到在高度腐蚀的化学镍上的厚浸金。

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《Journal of Electronic Materials》 |2001年第9期|共9页
作者
P. Snugovsky; P. Arrowsmith; M. Romansky;
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正文语种 eng
中图分类材料;
关键词
Solder joint; Black Pad; intermetallic formation; electroless Ni/immersion Au layer microstructure; electroless nickel/immersion gold (ENIG);

机译：焊点;黑垫;金属间化合物形成;化学镀镍/浸金层组织;化学镀镍/浸金（ENIG）;

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专利

1. Electroless Ni/Immersion Au Interconnects: Investigation of Black Pad in Wire Bonds and Solder Joints [J] . P. Snugovsky, P. Arrowsmith, M. Romansky Journal of Electronic Materials . 2001,第9期

机译：化学镀镍/浸金互连：焊线和焊点中的黑色焊盘的研究
2. The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating [J] . Kejun Zeng, Roger Stierman, Don Abbott, JOM . 2006,第6期

机译：化学镀镍/浸金的焊点黑色焊盘失效的根本原因
3. Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering [J] . Peng Sun, Cristina Andersson, Xicheng Wei, Materials Science and Engineering. B, Solid-State Materials for Advanced Technology . 2006,第2期

机译：回流焊后化学镀Ni（P）浸金表面上的Sn-Co-Cu，Sn-Ag-Cu和共晶Sn-Cu焊点中金属间化合物的形成
4. Lead-Free and Lead-Bearing Solder Intermetallic Fc rmation on Electroless Ni/Immersion Au Interconnects Affected by Black Pad [C] . P. Snugovsky, M. Kelly, Z. Bagheri, IPC SMEMA Council APEX Exhibition Conference: Proceedings of the Technical Program Jan 19-24, 2002 San Diego, California . 2002

机译：受黑色焊盘影响的化学镀镍/浸金金互连上的无铅和含铅焊料金属间腐蚀
5. The mechanical reliability of 1mil Au wire bonds in different bond pad opening shapes, sizes and placement accuracy. [D] . Napoli, Salvatore Thomas. 2014

机译：100万金丝键合在不同焊盘开口形状，尺寸和放置精度下的机械可靠性。
6. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint [O] . Sang-Yeob Lee, Jong-Hyuk Lee 2010

机译：焊接工艺和间隙距离对Ni-Cr合金焊接接头抗拉强度的影响
7. Structure Analysis of Solder Ball Joint Interface on Electroless Ni-B with Immersion Au deposition [O] . Takashi SUGIZAKI, Yasuji FUJITA, Takashi KIMURA, 2005

机译：浸没Au沉积电镀Ni-B焊球关节界面的结构分析

Electroless Ni/Immersion Au Interconnects: Investigation of Black Pad in Wire Bonds and Solder Joints

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