首页> 外文期刊>Journal of applied microbiology >Modelling the effect of temperature and water activity on growth of Aspergillus niger strains and applications for food spoilage moulds.
【24h】

Modelling the effect of temperature and water activity on growth of Aspergillus niger strains and applications for food spoilage moulds.

机译:模拟温度和水分活度对黑曲霉菌株生长的影响及其在食品变质霉菌中的应用。

获取原文
获取原文并翻译 | 示例
       

摘要

To develop a model for the combined effect of aw and temp. on growth of strains of Aspergillus niger and compare results with data on food spoilage fungi in the literature, an extended combined model describing growth of 2 strains of A. niger, as a function of temp. (25-30癈) and aw (0.90-0.99), was developed. Growth rate (mu) was expressed as the increase in colony radial growth per unit of time. This extended the previous square root model showing the relationship between temp. and bacterial growth rate and the parabolic relationship between the logarithm of the growth rate and aw. A good correlation between experimental data and model predictions was obtained with a regression coeff. of >0.99. In addition, use of this model allowed predictions of cardinal aw levels (aw(min), and aw(opt)). Estimation of min. aw levels (aw(min)) was in accordance with literature data for similar, and a range of other, Aspergillus and related species, regardless of the solutes used for aw modification. Estimation of optimum aw (aw(opt)) and optimum growth rate (muopt) were in good agreement with experimental results and literature data. It is concluded that this approach enables accurate prediction of the combined effects of environmental factors on growth of spoilage fungi for rapid prediction of cardinal limits using surface response curves, and will have applications for improving the shelf life of intermediate moisture foods.
机译:为aw和temp的组合效应开发模型。关于黑曲霉菌株生长的研究,并将结果与​​文献中有关食物腐败真菌的数据进行比较,该扩展组合模型描述了2种黑曲霉菌株的生长与温度的关系。 (25-30癈)和aw(0.90-0.99)被开发出来。生长速率(μ)表示为每单位时间菌落径向生长的增加。这扩展了先前的平方根模型,该模型显示了温度之间的关系。与细菌的生长速度以及生长速度的对数和aw之间的抛物线关系。通过回归系数可以获得实验数据与模型预测之间的良好相关性。大于0.99。此外,使用此模型可以预测主要的aw水平(aw(min)和aw(opt))。最小估算aw水平(aw(min))与相似的以及一系列其他曲霉和相关物种的文献数据一致,而与用于aw修饰的溶质无关。最佳aw(aw(opt))和最佳生长速率(muopt)的估计与实验结果和文献数据相吻合。结论是,该方法能够准确预测环境因素对腐败真菌生长的综合影响,从而利用表面响应曲线快速预测基数极限,并将在改善中间水分食品的货架期中得到应用。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号