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Synthesis and characterization of diphenylsilanediol modified epoxy resin and curing agent

机译:二苯基硅烷二醇改性环氧树脂和固化剂的合成与表征

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摘要

A series of diphenylsilanediol modified epoxy resins and novel curing agents were synthesized. The modified epoxy resins were cured with regular curing agent diethylenetriamine (DETA); the curing agents were applied to cure unmodified diglycidyl ether of bisphenol A epoxy resin (DGEBA). The heat resistance, mechanical property, and toughness of all the curing products were investigated. The results showed that the application of modified resin and newly synthesized curing agents leads to curing products with lower thermal decomposition rate and only slightly decreased glass transition temperature (T-g), as well as improved tensile modulus and tensile strength. In particular, products cured with newly synthesized curing agents showed higher corresponding temperature to the maximum thermal decomposition rate, comparing with products of DGEBA cured by DETA. Scanning electron microscopy micro images proved that a ductile fracture happened on the cross sections of curing products obtained from modified epoxy resins and newly synthesized curing agents, indicating an effective toughening effect of silicon-oxygen bond.
机译:合成了一系列的二苯基硅烷二醇改性环氧树脂和新型固化剂。改性的环氧树脂用常规的固化剂二亚乙基三胺(DETA)固化。固化剂用于固化双酚A环氧树脂(DGEBA)的未改性二缩水甘油醚。研究了所有固化产物的耐热性,机械性能和韧性。结果表明,改性树脂和新合成的固化剂的应用导致固化产物具有较低的热分解速率,并且玻璃化转变温度(T-g)仅略微降低,并且拉伸模量和拉伸强度得到改善。特别是,与通过DETA固化的DGEBA产品相比,使用新合成的固化剂固化的产品显示出更高的对应温度,达到最大热分解速率。扫描电子显微镜显微图像证明,由改性环氧树脂和新合成的固化剂制得的固化产物的截面上发生了韧性断裂,表明硅-氧键具有有效的增韧作用。

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