STUDY OF CURING KINETICS OF SILOXANE-MODIFIED DGEBA EPOXY RESINS

摘要

The curing kinetics of some epoxy resins of siloxane-modified diglycidyl ether of bisphenol A (ESDG) were studied by the dynamic differential scanning calorimetry method. The curing kinetic parameters are calculated by using the Ozawa method and are further verified by the Kissinger method. The results indicate a first-order curing kinetics for ESDG. The curing characteristics of ESDG have been observed to be influenced by the phenyl content of the siloxanes. The curing activation energies in the range of 80.3 to 88.1 KJ mol(-1) are obtained for these ESDG. The thermograms indicate that the ESDG exhibits a slightly higher initial temperature, as well as peak temperature, but a significantly narrower curing temperature range. The reason for the narrow curing temperature range may due to the low concentration of - OH group in the ESDG, and thus little process of ether linkage is taken place in the curing process. This suggests that ESDG can be cured more efficiently than the normal DGEBA epoxy resins. (C) 1996 John Wiley & Sons, Inc. [References: 41]