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Defect-induced electronic conduction of tBN thin films

机译:缺陷诱导的tBN薄膜的电子传导

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摘要

Two kinds of turbostratic boron nitride (tBN) thin films were deposited by sputtering with pure Ar or N_2 plasma in an ultraclean vacuum chamber. Current-voltage (I-V) characteristics of Ti/tBN/Ti structures revealed that films deposited in Ar showed at least three-orders higher conductivity with strong temperature and electric field dependence compared with those deposited in pure N_2. The origin of the higher conductivity was confirmed to be the nonstoichiometry and higher defect density of the tBN films. On the other hand, films deposited in pure N_2 plasma showed the characteristics of intrinsic insulator even though the basal plane of tBN was oriented normal to the substrate, namely, parallel to the direction of electronic conduction.
机译:通过在纯净真空室中用纯Ar或N_2等离子体溅射沉积两种涡轮层氮化硼(tBN)薄膜。 Ti / tBN / Ti结构的电流-电压(I-V)特征表明,与纯N_2相比,沉积在Ar中的薄膜具有至少三倍的导电率,并且具有较强的温度和电场依赖性。证实较高电导率的起因是tBN膜的非化学计量和较高的缺陷密度。另一方面,即使tBN的基面垂直于基板(即平行于电子传导方向)定向,在纯N_2等离子体中沉积的膜也显示出本征绝缘体的特性。

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