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Growth and properties of CVD diamond films grown under H{sub}2S addition

机译:在H {sub} 2S添加下生长的CVD金刚石膜的生长和性能

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摘要

The influence of H{sub}2S on the CVD diamond growth, the sulfur incorporation and the electronic properties of sulfur containing homoepitaxial diamond films were studied. Laser reflection interferometry (LRT) in combination with mass spectroscopy (Ms) showed that H{sub}2S modifies the gas phase chemistry by reducing the concentration of CH{sub}x species. As a consequence thereof, at high deposition temperatures the growth rate decreased. At lower substrate temperatures, the observed increase in the growth rate after sulfur addition indicates that these gas phase effects are overcompensated by processes at the growing diamond surface. The incorporation coefficient of sulfur into the definitely boron free diamond films was very low (less than 10{sup}(-6)). Incorporation seems to be enhanced by a reduction of the substrate temperature, by the presence of Si and, most effectively, by addition of CO{sub}2. For 0.5% CO{sub}2 in the gas mixture a maximum S concentration of 480 ppm (9 × 10{sup}19/cm{sup}3) corresponding to an incorporation coefficient of 6 × 10{sup}(-4) was attained. Even for the highest H{sub}2S concentrations (nearly 1%) the deposited diamond films preserve their excellent quality as judged from μ-Raman measurements. The electrical properties were not changed by the S incorporation. The electrical conductivity is thermally activated with typically 1.4-1.5 eV independent from the S concentration in the films. No values below 1.0 eV have been measured which argues against doping.
机译:研究了H {sub} 2S对CVD金刚石生长,含硫量和含硫同质外延金刚石膜电子性能的影响。激光反射干涉仪(LRT)与质谱(Ms)的结合表明,H {sub} 2S通过降低CH {sub} x种类的浓度来改变气相化学性质。结果,在高沉积温度下,生长速率降低。在较低的基材温度下,观察到的添加硫之后生长速率的增加表明,这些气相效应被金刚石表面生长过程所过度补偿。硫在绝对不含硼的金刚石薄膜中的掺入系数非常低(小于10 {sup}(-6))。通过降低衬底温度,通过存在Si以及最有效地通过添加CO {sub} 2,似乎增强了结合。对于混合气体中0.5%的CO {sub} 2,最大S浓度为480 ppm(9×10 {sup} 19 / cm {sup} 3),对应的掺入系数为6×10 {sup}(-4)达到了。甚至对于最高的H {sub} 2S浓度(接近1%),沉积的金刚石膜仍保持其出色的质量,这是根据μ拉曼测量得出的。 S并没有改变电性能。导电率通常在1.4-1.5 eV范围内被热激活,与膜中的S浓度无关。未测量到低于1.0 eV的值,这不利于掺杂。

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