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Modification of emission properties of diamond films due to surface treatment process

机译:通过表面处理工艺改变金刚石薄膜的发射特性

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The modification on the characteristics of the chemical vapor deposited (CVD) diamond films due to H_2-plasma post-treatment, SiO_2-coating and Cr-coating has been examined. A negatively biased H_2-plasma post-treatment process leads to pronounced modification on the morphology, Raman spectroscopy and electron field emission properties of the diamond films, whereas a positively biased H_2-plasma post-treatment process changes these characteristics insignificantly. The emission current density of the diamond films increased markedly to 162.1 #mu# A cm~(-2) due to negatively biased H_2-plasma etching, which is presumably caused by the formation of nano-sized columnar grains resulted from the etching of diamonds. On the other hand, the electron field emission capacity of the diamond films was completely suppressed due to the coating and chemical etching of SiO_2 layer, which is ascribed to the formation of a silicon-oxy-carbon (Si_(1-x-y)C_xO_(2y)) layer. Only when the SiO_2 layer is subjected to a negatively biased (-50 V) H_2-plasma etching process, can the electron field emission capacity of the diamond films be fully recovered. In contrast, emission current density (J_e) was increased substantially to 642 #mu# A cm~(-2) and the turn-on field (E_o) was lowered from 10.2 to 5.8 V #mu# m~(-1) due to Cr-coating. Scanning electron microscopic (SEM) and Auger electron spectroscopic (AES) examinations reveal that the main factor improving these behaviors for the Cr-coated diamond films is the formation of diamond-like carbon films on their top surface.
机译:研究了由于H_2等离子体后处理,SiO_2涂层和Cr涂层对化学气相沉积(CVD)金刚石薄膜特性的影响。负偏压的H_2-等离子体后处理导致金刚石薄膜的形态,拉曼光谱和电子场发射特性发生明显改变,而正偏压的H_2-等离子体后处理则无明显变化。金刚石薄膜的发射电流密度由于H_2-等离子刻蚀的负偏压而显着增加到162.1#mu#A cm〜(-2),这大概是由于金刚石刻蚀导致形成的纳米级柱状晶粒引起的。 。另一方面,由于SiO_2层的涂覆和化学蚀刻,金刚石膜的电子场发射能力被完全抑制,这归因于形成了硅氧碳(Si_(1-xy)C_xO_( 2y))层。只有对SiO_2层进行负偏压(-50 V)H_2等离子体刻蚀,才能完全恢复金刚石膜的电子场发射能力。相反,发射电流密度(J_e)显着增加至642#mu#A cm〜(-2),导通电场(E_o)从10.2 V降至5.8 V#mu#m〜(-1)镀铬。扫描电子显微镜(SEM)和俄歇电子能谱(AES)检查表明,改善Cr涂层金刚石膜的这些行为的主要因素是在其顶表面形成类金刚石碳膜。

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