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首页> 外文期刊>Diamond and Related Materials >Adhesion improvements for diamond-like carbon films on polycarbonate and polymethylmethacrylate substrates by ion plating with inductively coupled plasma
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Adhesion improvements for diamond-like carbon films on polycarbonate and polymethylmethacrylate substrates by ion plating with inductively coupled plasma

机译:通过电感耦合等离子体的离子镀改善聚碳酸酯和聚甲基丙烯酸甲酯基板上类金刚石碳膜的附着力

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摘要

An inductively coupled plasma (ICP) ion plating method using hexamethyldisiloxane (HMDSO) and oxygen reactants was employed to deposit hard diamond-like carbon (DLC) coatings on polycarbonate (PC) and polymethylmethacrylate (PMMA) substrates. O_2 plasma was the most effective pretreatment method for improving the adhesion of the DLC on the polymer by removing the contaminants and forming the polar functional groups on the surfaces. The adhesion of the DLC film on the PMMA substrate was always much worse than that on the PC substrate. To improve the DLC film adhesion on the PMMA substrate, interfacial layers were deposited by remote plasma polymerization in order to avoid the destruction of the functional groups in the monomer precursors. Interfacial layers deposited using HMDSO/C_2H_5OH mixture, methylmethacrylate and propylene oxide monomers were successful to improve the adhesion of the DLC films on the PMMA from 1A (with no interfacial layer) to 4A-5A, as measured by the X-cut method. The adhesion abilities of the interfacial layers were strongly dependent on the gas phase reactions during depositions. To understand the critical roles of the interfacial layers, the effects of the deposition conditions ad well as the structures of the interfacial layers were studied.
机译:使用六甲基二硅氧烷(HMDSO)和氧反应物的电感耦合等离子体(ICP)离子电镀方法用于在聚碳酸酯(PC)和聚甲基丙烯酸甲酯(PMMA)基板上沉积类金刚石硬质碳(DLC)涂层。 O_2等离子体是通过去除污染物并在表面形成极性官能团来提高DLC在聚合物上的附着力的最有效的预处理方法。 DLC膜在PMMA基底上的粘附力总是比PC基底上的粘附力差得多。为了改善DLC膜在PMMA基底上的附着力,通过远程等离子体聚合沉积界面层,以避免破坏单体前体中的官能团。通过X切割法测量,使用HMDSO / C_2H_5OH混合物,甲基丙烯酸甲酯和环氧丙烷单体沉积的界面层成功地将DLC膜在PMMA上的粘附力从1A(无界面层)提高到4A-5A。界面层的粘附能力在很大程度上取决于沉积过程中的气相反应。为了理解界面层的关键作用,研究了沉积条件的影响以及界面层的结构。

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