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Device scaling of pseudo-vertical diamond power Schottky barrier diodes

机译:伪垂直金刚石功率肖特基势垒二极管的器件定标

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Device size scaling of pseudo-vertical diamond Schottky barrier diodes (SBDs) has been characterized for high-power device applications based on the control of doping concentration and thickness of the p~- CVD diamond layer. Decreasing parasitic resistance on the p~+ layer utilising lithography and etching realises a constant specific on-resistance of less than 20 m OMEGA cm~2 with increasing device size up to 200 mu m. However, the leakage current under low reverse bias conditions is increased markedly. Due to the increase in the leakage current, the reverse operation limit is decreased from 2.4 to 1.3 MV/cm when the device size is increased from 30 to 150 mu m. If defects induce an increase in leakage current under the reverse conditions, the density of the defects can be estimated to be 10~4-10~5/cm~2. This value is 5-10 times larger than the density of dislocations in single crystal diamond 1b substrate.
机译:伪垂直金刚石肖特基势垒二极管(SBD)的器件尺寸缩放已基于p-CVD金刚石层的掺杂浓度和厚度控制,针对高功率器件应用进行了表征。利用光刻和蚀刻降低p〜+层上的寄生电阻可实现小于20 m OMEGA cm〜2的恒定比导通电阻,并且器件尺寸最大可增加到200μm。但是,在低反向偏置条件下的泄漏电流显着增加。由于泄漏电流的增加,当器件尺寸从30微米增加到150微米时,反向操作极限从2.4 MV / cm降低到1.3 MV / cm。如果缺陷在相反的条件下引起泄漏电流的增加,则缺陷的密度可以估计为10〜4-10〜5 / cm〜2。该值比单晶金刚石1b衬底中的位错密度大5-10倍。

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