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DC and RF performance of surface channel MESFETs on H-terminated polycrystalline diamond

机译:H端多晶金刚石上的表面沟道MESFET的DC和RF性能

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摘要

DC and RF performance of submicron gate-length metal-semiconductor field effect transistors (MESFETs) fabricated on hydrogen-terminated polycrystalline diamond is investigated in detail for different material electronic quality (grain size in the range 100-200 mu m) and device geometry (drain-source channel length in the range 1-3 mu m). DC characteristics appear almost independent of both properties, giving maximum drain-source current values in the range 120-140 mA/mm in MESFETs having same gate length (0.2 mu m) and gate width (25 mu m). The layer properties underneath the hydrogenated surface seem then to affect the DC behaviour to a lesser extent when the same hydrogenation procedure is used. At variance, the electronic quality of diamond layers employed for MESFETs realization largely affects the RF performance, resulting into a low oscillation frequency f_max for a MESFET realized by a self-aligned process (1 mu m drain-source channel length) onto low quality diamond polycrystalline film. Such a performance improves to f_max = 35 GHz for devices realized onto large grain polycrystalline diamond, although fabricated without self-aligned gate procedure (3 mu m drain-source channel length). These findings are discussed in terms of different roles played by surface hydrogenation, device geometry detail and electronic quality of the polycrystalline diamond substrate for MESFET realization.
机译:针对不同材料的电子质量(粒度在100-200μm范围内)和器件几何形状(漏源沟道长度在1-3微米之间)。直流特性几乎与两种特性无关,在具有相同栅极长度(0.2微米)和栅极宽度(25微米)的MESFET中,最大漏极-源极电流值在120-140 mA / mm范围内。当使用相同的氢化程序时,氢化表面下的层性质似乎在较小程度上影响DC性能。不同的是,用于实现MESFET的金刚石层的电子质量在很大程度上影响RF性能,导致通过对低质量金刚石进行自对准过程(漏源沟道长度为1μm)实现的MESFET的低振荡频率f_max多晶膜。对于在大晶粒多晶金刚石上实现的器件,这种性能可提高到f_max = 35 GHz,尽管这种器件无需进行自对准栅工艺(漏源沟道长度为3μm)即可制造。将根据表面氢化作用,器件几何结构细节和实现MESFET的多晶金刚石基板的电子质量所起的不同作用来讨论这些发现。

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