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Trends in pick-and-place systems

机译:取放系统的趋势

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摘要

Boosting output and reducing costs are the primary concerns of OEMs and CEMs alike, and placement machinery manufacturers are constantly striving to improve their equipment and support packages to serve an increasingly competitive global marketplace.Needless to say, the development of placement technology proceeds against a background of constantly evolving component packages and component densities. One of the major challenges which face machinery manufacturers if to provide a smooth upgrade path to deal with new packages while limiting capital costs. The other is to maximise the uptime of their equipment, in response to market forces which place up-time ahead for outright speed on the wants list of manufacturers looking to gain competitive advantage from lowest cost per placement.
机译:提高产量和降低成本一直是OEM和CEM的主要问题,贴装机械制造商正不断努力改进其设备和支持套件,以服务于日益竞争的全球市场。不用说,贴装技术的发展是在背景下进行的。不断发展的组件封装和组件密度。机械制造商面临的主要挑战之一,就是要提供一条平滑的升级路径来处理新包装,同时又要限制资本成本。另一种方法是最大限度地延长设备的正常运行时间,以响应市场力量,将正常运行时间提前以绝对的速度放在希望从最低的单次生产成本中获得竞争优势的制造商需求列表中。

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