...
首页> 外文期刊>Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology >Growth process of CuO(111) and Cu2O(001) thin films on MgO(001) substrate under metal-mode condition by reactive dc-magnetron sputtering
【24h】

Growth process of CuO(111) and Cu2O(001) thin films on MgO(001) substrate under metal-mode condition by reactive dc-magnetron sputtering

机译:反应模式磁控溅射在金属模式下MgO(001)衬底上CuO(111)和Cu2O(001)薄膜的生长过程

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

The growth process of CuO and CU2O thin films on MgO(0 0 1) substrates by reactive dc-magnetron sputtering was studied by reflection high-energy electron diffraction (RHEED) and atomic-force microscopy (AFM). The RHEED pattern and AFM image showed that (1) three-dimensional Cu(0 0 1) islands grew on MgO under the nonreactive sputtering condition, (2) CuO(1 1 1) was deposited layer by layer on MgO at 400 degrees C under the reactive sputtering condition, and (3) the film deposited at 600 degrees C in the initial growth stage was composed of three-dimensional Cu islands because O-2 gas could not be incorporated into them due to the low sticking coefficient of 02 on MgO under the reactive sputtering condition. The layer-by-layer CuO(1 1 1) thin-film growth process is discussed from the viewpoint that Cu and oxygen species are supplied in stoichiometry onto the MgO substrate to form CuO thin-film crystals while maintaining minimum interfacial energy between CuO and MgO. (c) 2007 Elsevier Ltd. All rights reserved.
机译:通过反射高能电子衍射(RHEED)和原子力显微镜(AFM)研究了反应性直流磁控溅射在MgO(0 0 1)衬底上CuO和CU2O薄膜的生长过程。 RHEED图案和AFM图像显示(1)在非反应溅射条件下在MgO上生长了三维Cu(0 0 1)岛,(2)在400摄氏度下在MgO上逐层沉积了CuO(1 1 1) (3)在初始生长阶段在600摄氏度下沉积的薄膜由三维Cu岛组成,因为O-2气体由于02的低粘附系数而无法引入其中,反应溅射条件下的MgO。从化学计量的角度将Cu和氧物种供应到MgO衬底上以形成CuO薄膜晶体,同时保持CuO和Al之间的最小界面能的角度讨论了逐层CuO(1 1 1)薄膜的生长过程。氧化镁(c)2007 Elsevier Ltd.保留所有权利。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号