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首页> 外文期刊>Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology >Angular dependences of surface composition, sputtering and ripple formation on silicon under N{sup}+{sub}2 ion bombardment
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Angular dependences of surface composition, sputtering and ripple formation on silicon under N{sup}+{sub}2 ion bombardment

机译:N {sup} + {sub} 2离子轰击下硅表面成分,溅射和波纹形成的角度依赖性

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摘要

The correlation between angular dependences of surface composition and sputtering yield of Si by (N{sub}2){sup}+ ions was found. It may explain anamalous (in comparison to Ai ion bombardment on Si) sharp increasing of sputtering yield at angles of ion incidence over 30°. Angular range of ripple formation on Si surface bombarded by 1.5-9 keV (N{sub}2){sup}+ ions was measured. It belongs to the interval of angles of ion incidence where heterogeneity of surface layers and pronounced changes of sputtering were observed.
机译:发现表面成分的角度依赖性与(N {sub} 2){sup} +离子对Si的溅射产率之间的相关性。它可以解释在30%的离子入射角下,溅射产率急剧增加(与Si上的Al离子轰击相比)急剧增加。测量了被1.5-9 keV(N {sub} 2){sup} +离子轰击的Si表面波纹形成的角度范围。它属于离子入射角的间隔,在该间隔中观察到表面层的不均匀性和溅射的明显变化。

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