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Transition from ripples to faceted structures under low-energy argon ion bombardment of silicon: understanding the role of shadowing and sputtering

机译:在硅的低能氩离子轰击下从波纹到刻面结构的转变:了解阴影和溅射的作用

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摘要

AbstractIn this study, we have investigated temporal evolution of silicon surface topography under 500-eV argon ion bombardment for two angles of incidence, namely 70° and 72.5°. For both angles, parallel-mode ripples are observed at low fluences (up to 2 × 1017 ions cm-2) which undergo a transition to faceted structures at a higher fluence of 5 × 1017 ions cm-2. Facet coarsening takes place at further higher fluences. This transition from ripples to faceted structures is attributed to the shadowing effect due to a height difference between peaks and valleys of the ripples. The observed facet coarsening is attributed to a mechanism based on reflection of primary ions from the facets. In addition, the role of sputtering is investigated (for both the angles) by computing the fractional change in sputtering yield and the evolution of surface roughness.
机译:摘要在这项研究中,我们研究了在500 eV氩离子轰击下两个入射角(即70°和72.5°)下硅表面形貌的时间演化。对于这两个角度,在低注量下(高达2×10 17 离子cm -2 )观察到平行模式的波纹,并以较高的注量过渡到刻面结构5×10 17 离子cm -2 小面粗化在更高的注量下发生。从波纹到多面结构的这种过渡归因于由于波纹的峰谷之间的高度差而产生的阴影效应。观察到的小平面粗糙化归因于基于从小平面反射一次离子的机制。另外,通过计算溅射产率的分数变化和表面粗糙度的演变,研究了溅射的作用(对于两个角度)。

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