Mask of amorphous hydrogenated carbon films applied to chemical polishing and chemical dicing of silicon wafers

摘要

Amorphous hydrogenated carbon (a-C: H) films deposited by r.f. chemical vapour deposition technique were studied as masks for the processes of chemical polishing and chemical dicing of silicon slices. After the photolithographic processing onselected areas, layers of a-C: H films of about 70 nm thick were deposited on the polished plane of silicon wafers and the a-C: H film was patterned by the lift-off process. The silicon samples chemically etched in an aqueous solution of fluoridric,nitric and acetic acids (CP4) were observed by optical microscopy. For time intervals and chemical solution composition used, no thickness variations of the a-C: H film were observed. Moreover, samples where the a-C: H film was removed by oxygen, plasmaetching were also observed, but no etch pits appeared on the underneath surfaces.