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首页> 外文期刊>Heat Transfer Research >NUMERICAL STUDY OF THREE-DIMENSIONAL CONJUGATE HEAT TRANSFER IN LIQUID MINI-SCALE HEAT SINK
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NUMERICAL STUDY OF THREE-DIMENSIONAL CONJUGATE HEAT TRANSFER IN LIQUID MINI-SCALE HEAT SINK

机译:液体微型水槽中三维共轭传热的数值研究

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This paper presents a numerical study of the effect of the substrate material and liquid cooling medium on the heat transfer characteristics for three-dimensional conjugate heat transfer problem of laminar flow through a circular minichannel. A uniform heat flux of 100 kW/m~2 is applied at the bottom-side of the substrate while the topside surface is considered adiabatic. Three different materials of the substrate have been adopted: copper (k_s = 398 W/m·K), silicon (k_s = 189 W/m·K), and stainless steel (k_s = 15.9 W/m·K). Two different coolant liquids have also been proposed - water and mercury. The thermal characteristics of the conjugate heat transfer problem are represented by the local Nusselt (Nu) number, local bottom-side surface temperature of the channel, local heat flux, and local temperature difference between the solid and fluid domains. The effect of inlet coolant velocity is investigated with two different inlet velocities of 0.1 m/s and 0.05 m/s. The study shows that the thermal characteristics of the minichannel using water as a coolant medium with the three different substrate materials are in contradiction with those of the minichannel using mercury. The contradiction is generated as a result of the competitive effects of axial fluid conduction, and axial wall conduction as well as the competitive effects of the radial and circumferential heat diffusion in the fluid domain. The theoretical model has been verified by comparing the predicated results with those obtained from the available analytical and experimental data with maximum deviation of 6.7%. The study is considered as the benchmark and helpful guidelines in the design of small-scale circular channels which are used for electronic cooling systems.
机译:本文对层状流通过圆形小通道的三维共轭传热问题,研究了基底材料和液体冷却介质对传热特性的影响的数值研究。在基板的底面施加100 kW / m〜2的均匀热通量,而顶面被认为是绝热的。已采用三种不同的基板材料:铜(k_s = 398 W / m·K),硅(k_s = 189 W / m·K)和不锈钢(k_s = 15.9 W / m·K)。还提出了两种不同的冷却液-水和汞。共轭传热问题的热特性由局部Nusselt(Nu)数,通道的局部底侧表面温度,局部热通量以及固体和流体域之间的局部温差表示。在两种不同的入口速度0.1 m / s和0.05 m / s下研究了入口冷却剂速度的影响。研究表明,使用水作为冷却剂介质并使用三种不同基材的微型通道的热特性与使用汞的微型通道的热特性相矛盾。由于轴向流体传导和轴向壁传导的竞争效应以及流体域中径向和周向热扩散的竞争效应而产生矛盾。通过将预测结果与从可用分析和实验数据获得的结果进行比较,从而验证了理论模型,最大偏差为6.7%。该研究被认为是用于电子冷却系统的小型圆形通道设计的基准和有用的指导。

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