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Relationship between mechanical properties of thin nitride-based films and their behaviour in nano-scratch tests

机译:氮化物基薄膜的机械性能与其在纳米划痕试验中的行为之间的关系

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摘要

TiFeN, TiN and TiFeMoN films were deposited on silicon using a dual ion beam system. High resolution Scanning Electron Microscopy (SEM) has been used in conjunction with progressive load nano-scratch testing and nanoindentation to investigate film behaviour in highly loaded sliding and mechanical properties. Nitrogen ion assistance in TiFeN resulted in compositional changes to the films that created a larger fraction of softer FeN phase. Harder films exhibited higher ratios of hardness to modulus (H/E_r). At low scratching loads, the mechanical properties of the film itself control nano-scratch behaviour and films with higher H/E and lower plasticity indices are more resistant. At higher scratching load, the failure of harder films with H/E_r > 0.11 was accompanied by delamination outside the scratch track. It is suggested that hard films with H/E_r ≤ 0.11 possess a more optimum combination of hardness and toughness for applications where they will be exposed to high shearing forces and strain in the film in this case is more readily relieved by intergrain cracking.
机译:使用双离子束系统将TiFeN,TiN和TiFeMoN薄膜沉积在硅上。高分辨率扫描电子显微镜(SEM)已与渐进载荷纳米划痕测试和纳米压痕结合使用,以研究膜在高载荷滑动和机械性能方面的行为。 TiFeN中的氮离子辅助作用会导致薄膜成分发生变化,从而形成较大比例的较软的FeN相。较硬的膜表现出较高的硬度与模量比(H / E_r)。在低的划痕载荷下,薄膜本身的机械性能控制着纳米划痕行为,具有较高的H / E和较低的可塑性指数的薄膜更具抵抗力。在较高的刮擦载荷下,H / E_r> 0.11的较硬膜的失效伴随着刮擦痕迹的分层。建议将H / E_r≤0.11的硬质薄膜在暴露于高剪切力的应用中具有硬度和韧性的最佳组合,在这种情况下,薄膜间的裂纹更容易消除薄膜中的应变。

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