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首页> 外文期刊>Journal of nanoscience and nanotechnology >A study of nano-mechanical properties-and nano-scratch behavior of boron carbonitride films
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A study of nano-mechanical properties-and nano-scratch behavior of boron carbonitride films

机译:碳氮化硼薄膜的纳米力学性能和划痕行为的研究

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摘要

Boron carbonitride (BCN) films were deposited by d.c. unbalanced magnetron sputter deposition where a substrate bias ranging from -50 V to -300 V was applied to the sample. X-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy were used to confirm the composition and bonding structure of the BCN films. Surface morphology and roughness were analyzed by atomic force microscopy. The nano-mechanical properties and nano-scratch behavior of the prepared films were determined by a nano-indentation system equipped with continuous stiffness measurement and lateral-force measurement attachments. The results indicate that there is little change in the content of B, C, and N. The films deposited are compounds with hybridized B-C-N bonds and the disordered degree of the structure increases with increasing the substrate bias. The substrate biasing can enhance the nanobardness, elastic modulus, nano-scratch resistance, and cohesion strength of the deposited films. During the nano-scratch test, plastic deformation and ploughing wear appears for the BCN films deposited at lower bias. Elastic deformation becomes the dominant deformation mechanism for the films deposited at higher bias. The coefficient of friction between the deposited BCN films and the diamond tip depends on the loading critical load. The increasing of the substrate bias leads to the improvement of the critical load and the elastic deformation proportion.
机译:直流沉积碳氮化硼(BCN)膜。不平衡磁控溅射沉积,其中将样品偏压范围从-50 V到-300V。用X射线光电子能谱和傅里叶变换红外光谱来确定BCN膜的组成和键合结构。通过原子力显微镜分析表面形态和粗糙度。通过配备连续硬度测量和横向力测量附件的纳米压痕系统,确定所制备薄膜的纳米机械性能和纳米划痕行为。结果表明,B,C和N的含量几乎没有变化。沉积的膜是具有杂化B-C-N键的化合物,结构的无序度随基底偏压的增加而增加。基板偏压可以增强沉积膜的纳米级硬度,弹性模量,耐纳米划痕性和内聚强度。在纳米划痕试验中,以较低的偏压沉积的BCN膜出现塑性变形和犁磨损。弹性变形成为在较高偏压下沉积的薄膜的主要变形机制。沉积的BCN膜和金刚石尖端之间的摩擦系数取决于载荷临界载荷。基板偏压的增加导致临界载荷和弹性变形比例的改善。

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