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首页> 外文期刊>Surface and Interface Analysis: SIA: An International Journal Devoted to the Development and Application of Techniques for the Analysis of Surfaces, Interfaces and Thin Films >ToF-SIMS studies of nanoporous PMSSQ materials: kinetics and reactions in the processing of low-K dielectrics for ULSI applications
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ToF-SIMS studies of nanoporous PMSSQ materials: kinetics and reactions in the processing of low-K dielectrics for ULSI applications

机译:纳米多孔PMSSQ材料的ToF-SIMS研究:用于ULSI应用的低K电介质加工的动力学和反应

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摘要

Detailed investigations of spin-on polymethylsilsesquioxane (PMSSQ)-based low-K materials were carried out by means of time-of-flight secondary ion mass spectrometry (ToF-SIMS) to identify the reaction kinetics and mechanisms occurring during the manufacturing of nanoporous dielectrics for ULSI applications. Analysis of the static SIMS fingerprints led to the identification of key species related to the PMSSQ oligomers, as well to the observation of features related to the initial functionality of the precursor materials. The intensity variations of the key species with thermal curing reveal the polymerization kinetics of the dielectric precursors. In addition, thermal decomposition and volatilization of the polymethylmethacrylate-dimethylaminoethylmethacrylate copolymer (PMMA-co-DMAEMA) porogen was established based on the detection of fragments related to the different moieties of the copolymer molecule. Porogen degradation takes place via cleavage of the DMAEMA co-monomer at low temperature, followed by volatilization of the residual PMMA-enriched polymer upon annealing at higher temperature. Several complementary phenomena occurring during the formation of these complex systems can be evaluated by ToF-SIMS, revealing major features crucial to materials development and the manufacturing of novel low-dielectric-constant (K) dielectrics. Copyright (C) 2004 John Wiley Sons, Ltd.
机译:通过飞行时间二次离子质谱(ToF-SIMS)进行了基于旋涂聚甲基硅倍半氧烷(PMSSQ)的低K材料的详细研究,以识别纳米多孔电介质制造过程中发生的反应动力学和机理适用于ULSI应用。静态SIMS指纹的分析导致与PMSSQ低聚物有关的关键物种的鉴定,以及与前体材料的初始功能有关的特征的观察。关键物质随热固化的强度变化揭示了电介质前体的聚合动力学。另外,基于与共聚物分子的不同部分有关的片段的检测,建立了聚甲基丙烯酸甲酯-甲基丙烯酸二甲氨基乙基甲基酯共聚物(PMMA-co-DMAEMA)致孔剂的热分解和挥发。致孔剂的降解是通过在低温下裂解DMAEMA共聚单体而发生的,然后在较高温度下退火后,残留的富集PMMA的聚合物挥发。可以通过ToF-SIMS评估在这些复杂系统的形成过程中发生的几种互补现象,这些现象揭示了对于材料开发和新型低介电常数(K)电介质制造至关重要的主要特征。版权所有(C)2004 John Wiley Sons,Ltd.

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