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首页> 外文期刊>Surface & Coatings Technology >Microstructure, mechanical properties and cutting performance of superhard (Ti,Si,Al)N nanocomposite films grown by d.c. reactive magnetron sputtering
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Microstructure, mechanical properties and cutting performance of superhard (Ti,Si,Al)N nanocomposite films grown by d.c. reactive magnetron sputtering

机译:直流电生长的超硬(Ti,Si,Al)N纳米复合薄膜的微观结构,力学性能和切削性能。反应磁控溅射

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This paper reports on the optimization of coating properties to improve the performance of tools in severe cutting conditions. Tungsten carbide tools coated with (Ti,Si,AI)N films deposited by d.c. reactive magnetron sputtering have been investigated. The structure and the hardness of the coated samples were analyzed by X-ray diffraction (XRD) and depth-sensing indentation, respectively. XRD results revealed a structure indexed to fcc TiN. The tool life and tool failure modes were examined for various cutting conditions. A promising wear performance of the (Ti,Si,AI)N coatings was confirmed by scanning electron microscopy observations complemented with energy dispersive X-ray spectrometry analysis. At higher cutting speed (200 m/min) it seems that after turning 15 min the cutting performance of (Ti,Si,AI)N coated tools is better than that presented by the commercial multilayer coating (TiCN/Al2O3/TiN)-which was used as a reference. Also regarding the final surface finish of the steel workpiece, the (Ti,Si,AI)N coatings outperformed the commercial tool, considering that the roughness of the workpiece is smaller in the former case (4 mum) than that measured in the latter one (12 mum). (C) 2003 Elsevier B.V. All rights reserved. [References: 30]
机译:本文报告了涂层性能的优化,以改善恶劣切削条件下刀具的性能。直流电沉积的(Ti,Si,Al)N薄膜涂覆的碳化钨工具已经研究了反应磁控溅射。分别通过X射线衍射(XRD)和深度感应压痕分析涂层样品的结构和硬度。 XRD结果显示了以fcc TiN为索引的结构。针对各种切削条件检查了刀具寿命和刀具故障模式。 (Ti,Si,Al)N涂层的有前途的磨损性能已通过扫描电子显微镜观察和能量色散X射线光谱分析的补充得到证实。在更高的切削速度(200 m / min)下,似乎在转动15分钟后,(Ti,Si,Al)N涂层刀具的切削性能要优于商用多层涂层(TiCN / Al2O3 / TiN)。用作参考。此外,考虑到前一种情况下的工件粗糙度(4毫米)比后一种情况下的粗糙度要小,在钢工件的最终表面光洁度方面,(Ti,Si,Al)N涂层的性能也优于商用工具。 (12妈妈)。 (C)2003 Elsevier B.V.保留所有权利。 [参考:30]

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