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Codeposition of micro- and nano-sized SiC particles in the nickel matrix composite coatings obtained by electroplating

机译:通过电镀获得的镍基复合涂层中的微米和纳米尺寸SiC颗粒的共沉积

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Micro- and nano-sized SiC particles were codeposited with nickel by electrolytic plating from a nickel sulfamate bath and the effects of plating parameters such as pH of the plating bath, SiC content in the plating bath, and stirring speed on the deposition behaviors of Ni-SiC composite coating layers were studied. The result revealed that the micro-sized SiC particles are more negative than the nano-sized SiC particles in the Zeta potential. The codeposition of SiC can be increased by increasing the SiC content in the plating bath and the pH of the plating bath within the present experimental range. In case of micro-sized SiC particles, increasing stirring speed always lowered the codeposition of SiC. In case of nanosized SiC particles, the codeposition of SiC showed a maximum at the stirring speed of 100 rpm. The nano-sized SiC particles are more difficult to codeposit than the micro-sized SiC particles and showed rougher plated surface compared with the micro-sized SiC particles, which may be attributable to the agglomeration of nano-sized SiC particles in the plating bath. (c) 2006 Published by Elsevier B.V.
机译:通过氨基磺酸镍电镀液的电解电镀,将镍与镍共沉积成微米级和纳米级SiC颗粒,电镀参数如电镀液的pH,电镀液中SiC的含量以及搅拌速度对Ni沉积行为的影响研究了SiC复合涂层。结果表明,在Zeta电势中,微米尺寸的SiC颗粒比纳米尺寸的SiC颗粒更负。通过在当前实验范围内增加镀浴中的SiC含量和镀浴的pH,可以增加SiC的共沉积。对于微米尺寸的SiC颗粒,提高搅拌速度总是会降低SiC的共沉积。在纳米尺寸的SiC颗粒的情况下,SiC的共沉积在100rpm的搅拌速度下显示出最大值。纳米级SiC颗粒比微米级SiC颗粒更难以共沉积,并且与微米级SiC颗粒相比镀层表面更粗糙,这可能归因于纳米级SiC颗粒在电镀液中的团聚。 (c)2006年由Elsevier B.V.发布

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