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Boride layer growth kinetics during boriding of molybdenum by the Spark Plasma Sintering (SPS) technology

机译:火花等离子体烧结(SPS)技术在钼硼化过程中硼化物层生长动力学

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Molybdenum borides have potential industrial applications as abrasive, corrosion-resistant and electrode materials due to their high hardness values, chemical inertness, and electronic conductivity. In this work, boride layers are formed on the surface of Mo samples using a pack boriding method with the assistant of the spark plasma sintering (SPS) technique. The process was performed in the temperature range 1000-1400 degrees C and with a holding time of 30 min at the preset temperature. The microstructure, microhardness, and fracture toughness of the molybdenum boride layer are investigated by optical microscopy, X-ray diffraction and microhardness indentations. Results showed that the boride layer, mainly composed of MoB, have thickness in the range similar to 6-155 mu m. The boriding kinetics is studied by linking the boride layer thickness with the boriding temperature. The activation energy and pre-exponential constant are estimated from the experimental results, and are found to be 218.8 J/ mol and 1.41 cm(2)/s respectively. The MoB layers have a preferred orientation in the (002) direction, which is reflected by a distinct columnar growth observed in the optical micrographs of polished cross-sections of SPS samples. (c) 2006 Elsevier B.V. All rights reserved.
机译:硼化钼由于具有较高的硬度值,化学惰性和电子传导性,因此具有潜在的工业应用作为磨料,耐腐蚀和电极材料。在这项工作中,在火花样品烧结(SPS)技术的辅助下,使用块硼化方法在Mo样品的表面上形成了硼化物层。该过程在1000-1400摄氏度的温度范围内进行,并在预设温度下保持30分钟。通过光学显微镜,X射线衍射和显微硬度压痕研究了硼化钼层的显微组织,显微硬度和断裂韧性。结果表明,主要由MoB组成的硼化物层的厚度在6-155μm的范围内。通过将硼化物层的厚度与硼化温度联系起来研究硼化动力学。从实验结果估计了活化能和指数前常数,发现分别为218.8 J / mol和1.41 cm(2)/ s。 MoB层在(002)方向上具有较好的方向,这由SPS样品的横截面的光学显微照片中观察到的明显的柱状生长反映出来。 (c)2006 Elsevier B.V.保留所有权利。

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