首页> 外文期刊>Surface & Coatings Technology >Fabrication and surface characterization of pulsed reactive closed-field unbalanced magnetron sputtered amorphous silicon nitride films
【24h】

Fabrication and surface characterization of pulsed reactive closed-field unbalanced magnetron sputtered amorphous silicon nitride films

机译:脉冲反应性近场不平衡磁控溅射非晶氮化硅膜的制备及表面表征

获取原文
获取原文并翻译 | 示例
获取外文期刊封面目录资料

摘要

Amorphous silicon nitride (a-SiNx) thin films were fabricated by pulsed reactive closed-field unbalanced magnetron sputtering ultra-high purity n-type single crystal silicon in Ar-N-2 mixtures. The effect of N-2 fraction on the discharge behavior, deposition rate, composition, chemical bonding configurations, surface morphology, nano-hardness, elastic modulus and optical band gap were primarily investigated. It was found that good stability of reactive sputtering process was maintained by the adoption of the bipolar pulsed magnetron power supply with 180 out-of-phase and the pulsed substrate bias. The arc events and the disappearing anode effect in DC reactive magnetron sputtering of a-SiNx films were prevented. A higher deposition rate (> 20 nm/min) for a-SiNx films was achieved. The radical transition of the sputtering mode leads to the deposition rate initially decreased dramatically and then slowly with the increase of N-2 fraction. N to Si atomic ratio (N/Si) gradually increased and N is preferentially incorporated in its NSi3 stoichiometric ratio configuration and the Si-N network followed a tendency to tetrahedral chemical order with the increase of N-2 fraction in the inlet gases. The a-SiNx films deposited at high N-2 fraction were consistently N-rich. The film surface microstructure was transformed from coarse granular mounds surrounded by tiny micro-void regions to homogeneous, continuous, dense and slender hills, as well as a progressive densification and refinement of the film microstructure occurs as the N-2 fraction is increased. With the increase of the N/Si atomic ratio, the resistance of the a-SiNx films surface region to plastic deformation improved; hardness and elastic modulus increased, correspondingly. The as-sputtered a-SiNx films exhibit good optical transparency in visible region and the optical band gap E-opt can be varied in a broad range of 1.70-3.62 eV depending on the Nz fraction in Ar-N-2 mixtures. The increment of optical band gap E-opt of the as-sputtered a-SiNx films is determined primarily by the recession of the valence band maximum. (c) 2004 Elsevier B.V All rights reserved.
机译:通过脉冲反应性闭合场不平衡磁控溅射超高纯度n型单晶硅在Ar-N-2混合物中制备非晶氮化硅(a-SiNx)薄膜。主要研究了N-2分数对放电行为,沉积速率,组成,化学键构型,表面形态,纳米硬度,弹性模量和光学带隙的影响。发现通过采用具有180°异相和脉冲衬底偏置的双极脉冲磁控管电源,可以保持反应溅射过程的良好稳定性。防止了a-SiNx膜的直流反应磁控溅射中的电弧事件和消失的阳极效应。对于a-SiNx膜,可以获得更高的沉积速率(> 20 nm / min)。溅射模式的自由基转变导致沉积速率最初急剧下降,然后随着N-2分数的增加而缓慢下降。 N与Si的原子比(N / Si)逐渐增加,并且N优先以其NSi3化学计量比构型掺入,并且随着进气中N-2分数的增加,Si-N网络遵循四面体化学顺序的趋势。以高N-2分数沉积的a-SiNx薄膜始终富含N。薄膜表面的微观结构从被微小的微空隙区域包围的粗粒丘转变为均匀,连续,密集和细长的丘陵,随着N-2分数的增加,薄膜的微观结构逐渐致密化和细化。随着N / Si原子比的增加,a-SiNx膜表面区域对塑性变形的抵抗力提高。硬度和弹性模量相应增加。溅射后的a-SiNx薄膜在可见光区域具有良好的光学透明性,根据Ar-N-2混合物中的Nz分数,光学带隙E-opt可以在1.70-3.62 eV的宽范围内变化。溅射的a-SiNx膜的光学带隙E-opt的增加主要由价带最大值的降低决定。 (c)2004 Elsevier B.V保留所有权利。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号