Photo-assisted activation of non-catalytic substrates using an excimer lamp for subsequent electroless copper plating is described. The palladium films formed and the pi-methallyl-dibenzoylmethyl-palladium(II) layers used were characterized using ultraviolet spectrophotometry and Fourier transform infrared spectroscopy. The variables which are important to the process are discussed, including the exposure time, UV intensity and chamber pressure. The photo-decomposition of the palladium compounds was found to be a function of both the UV dose and chamber pressure during irradiation. The selectivity of subsequent metal electroless plating using a commercial copper bath was demonstrated by irradiating the surfaces through a quartz contact mask. (C) 1998 Elsevier Science S.A. [References: 11]
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