An Analysis on the Effect of Temperature on Electrocrystallization Mechanism During Deposition of Cu Thin Films

摘要

The electrodeposition of copper on graphite was investigated at various bath temperatures of 25, 20, 15, 10 and 5 °C. Copper deposits were formed potentiostati-cally and characterized by electrochemical methods and scanning electron microscopy. It was found that the deposition of copper had mixed mass and charge transfer kinetics. Copper nucleated according to 3D instantaneous mechanisms for all temperature ranges. The extent of nucleation was found to be increased at low temperatures with a transition of dendritic type morphology to spherical copper deposition.