Low temperature diffusion bonding of stainless steel

摘要

Diffusion bonding of stainless steel (SS) has been attempted in temperature range of 623 - 773 K using multiple inter-layers of nickel, copper and silver. The intermediate layers were electro-deposited taking care to avoid oxidation at the interfaces. The bonded area was examined for the formation of any intermetallic compound through electron probe micro-analyzer (EPMA) and nano-indentation technique. Results indicate the absence of brittle intermetallics at the interfaces and the strength of the bonding was found to be satisfactory. The bond strength was found to be 130 ± 10 MPa and the bond was found to be leak tight with negligible leak rate.