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Study on springback in micro V-bending with consideration of grain heterogeneity

机译:考虑晶粒异质性的微V型弯曲回弹研究

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摘要

With the new development of microforming technology, the demand on the accuracy of the metallic microcomponents is elevating. Springback phenomenon is inevitable during sheet metal forming process and can cause unpredicted dimensional error. The previous research found that the springback value in microforming is difficult to be assessed as the sizes of tools and specimens downsize hundreds even thousands times. This paper focuses on improving the prediction accuracy of springback during micro V-bending. A finite element (FE) model of the micro V-bending has been established via ABAQUS/Standard commercial software where the specimen's microstructure is represented by Voronoi tessellations. With the consideration of the grain heterogeneity, each Voronoi tessellation has been employed with different grain mechanical properties based on experimental results. Corresponding micro V-bending tests have been carried out, and a good agreement between the experimental and simulation results indicates that the developed FE model can accurately predict springback in micro V-bending.
机译:随着微成型技术的新发展,对金属微部件精度的要求日益提高。在钣金成型过程中不可避免地会产生回弹现象,并且会导致无法预料的尺寸误差。先前的研究发现,由于工具和样本的尺寸缩小了数百甚至数千倍,因此难以评估微成形中的回弹值。本文着重于提高微V型弯曲过程中回弹的预测精度。通过ABAQUS / Standard商业软件建立了微V型弯曲的有限元(FE)模型,其中样品的微观结构由Voronoi镶嵌表示。考虑到晶粒的异质性,根据实验结果,采用了具有不同晶粒力学性能的每个Voronoi镶嵌。进行了相应的微V弯曲测试,实验结果与仿真结果吻合良好,表明所建立的有限元模型可以准确预测微V弯曲的回弹。

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