Adhesives for Assembly on Printed-Circuit Boards

A.A.Lukin; A.N.Parfenov; L.I.Anikhovskaya

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Adhesives for Assembly on Printed-Circuit Boards

机译：印刷电路板组装用胶粘剂

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Requirements for adhesives used in the surface-mount technique are presented.Properties of a heat-setting epoxy adhesive TPK-4 designed at the Semenov Institute of Chemical Physics of the Russian Academy of Sciences together with the OOO NPF Tekhpolikom are described.

机译：提出了用于表面贴装技术的胶粘剂的要求。描述了由俄罗斯科学院塞梅诺夫化学物理研究所设计的热固性环氧胶粘剂TPK-4以及OOO NPF Tekhpolikom的性能。

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《Polymer science, Series C》 |2007年第1期|共4页
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A.A.Lukin; A.N.Parfenov; L.I.Anikhovskaya;
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中图分类合成树脂与塑料工业;
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1. Adhesives for Assembly on Printed-Circuit Boards [J] . A.A.Lukin, A.N.Parfenov, L.I.Anikhovskaya Polymer science, Series C . 2007,第1期

机译：印刷电路板组装用胶粘剂
2. Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards [J] . J. Lee, C. S. Cho, J. E. Morris Microsystem technologies . 2009,第1期

机译：浸银印刷电路板上各向同性导电胶的电性能和可靠性
3. CONVECTIVE HEAT TRANSFER FROM SIMULATED AIR-COOLED PRINTED-CIRCUIT BOARD ASSEMBLY ON HORIZONTAL OR VERTICAL ORIENTATION [J] . C. W. Leung, H. J. Kang International Communications in Heat and Mass Transfer . 1998,第1期

机译：模拟空冷印刷电路板组件在水平方向或垂直方向上的对流换热
4. Case Studies of Adhesive and Rigid Insulation Board Failures due to Moisture in Low Sloped Roofing Assemblies [C] . David Straup Slick, Nicholas A. Piteo, Dean A. Rutila Symposium on durability of building and construction sealants and adhesives . 2012

机译：低坡度屋面组件中由于水分引起的粘合和刚性绝缘板故障的案例研究
5. Microstructure and mechanical properties of electroless copper and their influence on the reliability of printed-circuit boards. [D] . Lin, Kuanchih. 1990

机译：化学镀铜的微观结构和机械性能及其对印刷电路板可靠性的影响。
6. Screen-printed electrode produced by printed-circuit board technology. Application to Cancer Biomarker Detection by means of plastic antibody as sensing material [O] . Felismina T.C. Moreira, M. Judite M.S. Ferreira, José R.T. Puga, -1

机译：通过印刷电路板技术生产的丝网印刷电极。以塑料抗体为检测材料在癌症生物标志物检测中的应用
7. End-to-End Printed-Circuit Board Assembly Design Using Altium Designer and Solid Works Systems [O] . A. M. Goncharenko, A. E. Kurnosenko, V. G. Kostikov, 2015

机译：使用altium Designer和solid Works系统的端到端印刷电路板装配设计
8. Cure Analysis of Printed-Circuit Boards Containing Reactive Adhesive Layers. [R] . Fullerton, R., Roylance, D. K., Allred, R. E., 1989

机译：含有反应性粘合剂层的印刷电路板的固化分析。

Adhesives for Assembly on Printed-Circuit Boards

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