...
首页> 外文期刊>Plating & Surface Finishing >Investigation on the Stability of a Au-Sn Electroplating Solution
【24h】

Investigation on the Stability of a Au-Sn Electroplating Solution

机译:Au-Sn电镀液的稳定性研究

获取原文
获取原文并翻译 | 示例

摘要

The degradation of a chloride-based solution, used for simultaneous electrodeposition of Au-Sn alloys, has been studied using a combination of turbidity measurements, UV/Vis spectroscopy, XRD and SEM/TEM. Degradation virtually begins immediately after the solution is prepared, due to the gradual reduction of ionic complexes of gold by ascorbic acid. The resulting gold precipitates are initially less than 10 nm in size, but agglomerate after two to three days to form visible particles that settle and coat the container walls. To solve the bath stability problem, a thorough understanding of the mechanism of the Au-Sn plating process and the roles played by each ingredient are required.
机译:同时使用浊度测量,UV / Vis光谱,XRD和SEM / TEM研究了用于同时电沉积Au-Sn合金的氯化物基溶液的降解。实际上,由于抗坏血酸逐渐还原了金的离子络合物,因此实际上在溶液制备后立即开始降解。所得的金沉淀物最初的尺寸小于10 nm,但两到三天后发生团聚,形成可见的颗粒,沉淀并覆盖了容器壁。为了解决镀液稳定性问题,需要对Au-Sn镀覆过程的机理以及每种成分所起的作用有透彻的了解。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号