Polyamideimide resins were prepared using three monomeric reactants;5-norbornene-2,3' dicarboxylic anhydride (NA),4-aminobenzoic acid,and 3,4'-oxydianiline (3,4'-ODA).The characteristics of the resins were analyzed by FTIR and elemental analysis.The PAI/Copper composites were prepared at 320degC and a pressure of 30 Kg/cm~2 (2.9 Mpa).The heat resistance,chemical resistance,dielectric constant and dissipation factor were studied.The experimental results show that the peel strength of the composites with no coupling agent was 1.69 Kgf/cm(1657 N/m)and with 0.6% LICA97 coupling agent was 2.27 Kgf/cm(2225N/m) After 24h at 300degC,the dielectric constants of PAI.1 (0.6% lica97) were 2.46 and 2.47 (1MHz),and their dissipation factors were 0.0101 and 0.0110.After immersian in 10% H_2SO_4 solution,the peel strength retentions of the laminates were greater than 90%.
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机译：聚酰胺酰亚胺树脂是由三种单体反应物制备的：5-降冰片烯-2,3'-二羧酸酐（NA），4-氨基苯甲酸和3,4'-二苯胺（3,4'-ODA）。通过FTIR分析和元素分析，在320°C和30 Kg / cm〜2（2.9 Mpa）的压力下制备PAI /铜复合材料，研究了耐热性，耐化学性，介电常数和耗散系数，实验结果表明无偶联剂的复合材料的剥离强度为1.69 Kgf / cm（1657 N / m），含0.6％LICA97偶联剂的复合材料的剥离强度为300℃下24h，PAI的介电常数为2.27 Kgf / cm（2225N / m）。 1（0.6％lica97）分别为2.46和2.47（1MHz），耗散因子为0.0101和0.0110。将其浸入10％H_2SO_4溶液中后，层压板的剥离强度保持率大于90％。
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