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Kinetic investigation of Cu(Ⅱ) ions photoreduction in presence of titanium dioxide and formic acid

机译:二氧化钛和甲酸存在下Cu(Ⅱ)离子光还原的动力学研究

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The photoreduction of Cu(Ⅱ) in presence of an organic species as sacrificial agent has been investigated by many research groups but some controversial results are reported in literature. In this work, the photoreduction process of Cu(Ⅱ) in presence of formic acid is investigated aiming at clarifying the reaction mechanism and assess the reaction kinetics. The effect of operating conditions such as TiO_2 load, initial concentration of sacrificial agent, pH and ionic strength was studied. The results of the work are: (1) the system reactivity does not depend neither on pH (in the range 2.0-3.5) nor on ionic strength of the solution; (2) formic acid is adsorbed on TiO_2 surface; (3) the nature of anionic species can influence the Cu(Ⅱ) photoreduction (e.g. the addition of sulphate or phosphates reduces the reaction rates); and (4) FA can be completely mineralized during this photoxidation process; for example, this is observed for a TiO_2 load of 0.1 g/L after a reaction time of about 240 min. A simplified kinetic model is developed to describe the behavior of the system and validated by analysing the data collected during the experimental work.
机译:许多研究小组已经研究了在有机物种作为牺牲剂的情况下对Cu(Ⅱ)的光还原作用,但文献报道了一些有争议的结果。本文研究了在甲酸存在下Cu(Ⅱ)的光还原过程,旨在阐明反应机理并评估反应动力学。研究了TiO_2负载,牺牲剂初始浓度,pH和离子强度等操作条件的影响。工作的结果是:(1)系统反应性既不依赖于pH(在2.0-3.5范围内)也不依赖于溶液的离子强度; (2)甲酸吸附在TiO_2表面上; (3)阴离子种类的性质会影响Cu(Ⅱ)的光还原(例如,添加硫酸盐或磷酸盐会降低反应速率); (4)在此光氧化过程中,FA可以完全矿化;例如,在约240分钟的反应时间后,对于TiO_2负载为0.1 g / L观察到了这一点。开发了简化的动力学模型来描述系统的行为,并通过分析在实验工作期间收集的数据进行了验证。

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